| 832 |
Jawad Yousaf, Doojin Lee, JunHee Han, Hosang Lee, Muhammad Faisal, Jeongeun Kim and Wansoo Nah |
Near-Field Immunity Test Method for Fast Radiated Immunity Test Debugging of Automotive Electronics |
MDPI Electronics |
Vol. 8, No. 797, pp.1-18 |
2019.07 |
SCI |
EMC |
| 831 |
J.S. LEE, J.R. HA, M.H. KIM, S.W. YUN, Y.S. KIM, and W. Nah |
Prediction of conducted emission in a PMSM-drive braking system using a circuit model combined with EM simulation |
International Journal of Automotive Technology |
Vol. 20, No. 3, pp. 487-498 |
2019.06 |
SCI-E |
EMC |
| 830 |
Jawad Yousaf, Muhammad Faisal, Jinsung Youn, and Wansoo Nah |
Design of experiment (DOE) Analysis of System Level ESD Noise Coupling to High-Speed Memory Modules |
MDPI Electronics |
Vol. 8 No. 210, pp. 1-25 |
2019.02 |
SCI-E |
EMC |
| 829 |
Jawad Yousad, Hosang Lee, Wansoo Nah |
System Level ESD Analysis: Acomprehensive 2 on ESD Coupling Analysis Techniques |
Jouranl of Electrical Engineering and Technology |
Vol. 13, No. 5, pp. 2033-2045 |
2018.09 |
SCI-E |
EMC |
| 828 |
Jawad Yousad, Hosang Lee, Wansoo Nah |
System Level ESD Analysis: Acomprehensive 1 on ESD Generator Modeling |
Jouranl of Electrical Engineering and Technology |
Vol. 13, No. 5 |
2018.09 |
SCI-E |
EMC |
| 827 |
Sang-Woo Kim, Kwangho Kim, Wansoo Nah, Cheul-Ro Lee, Seung-Boo Jung, And Jong-Woong Kim |
Transparent and Flexible High frequency transmission Lines Based on Composite Structure Comprising Silver Nano wires and Polyvinyl Butyral |
Composites Science and Technology |
Vol. 159, pp. 25-32 |
2018.03 |
SCI |
EMC |
| 826 |
Jawad Yousaf, Myeongkoo Park, Hosang Lee, Jinsung Youn, Daehee Lee, Chanseok Hwang, and Wansoo Nah |
Efficient Circuit and an EM Model of an Electrostatic Discharge Generator |
IEEE Transactions On Electromagnetic Compatibility |
No. 99, pp. 1-9 |
2018.01 |
SCI |
EMC |
| 825 |
Jawad Yousaf, Jaeyoung Shin, Kwangho Kim, Jinsung Youn, Daehee Lee, Changseok Hwang, and Wansoo Nah |
System Level ESD Coupling Analysis Using Coupling Transfer Impedance Function |
IEEE Transactions On Electromagnetic Compatibility |
Vol. 60, No. 2, pp. 310-321 |
2018.04 |
SCI |
EMC |
| 824 |
Dongyoun Seo, Hosang Lee, Myeongkoo Park, and Wansoo Nah |
Enhancement of Differential Signal Integrity by employing a Novel Face Via Structure |
IEEE Transactions On Electromagnetic Compatibility |
Vol. 60, No. 1, pp. 26-33 |
2018.02 |
SCI |
EMC |
| 823 |
W.Lee, H.Kang, H. Lee, W. Lim, J. Bae, H. Koo, J. Yoon, K. Hwang, K. Lee, and Y. Yang |
Broadband Cascode InGaP/GaAs HBT Power Amplifier Integrated Circuit Using Cascode Structure and Optimized Shunt Inductor |
IEEE Transactions on Microwave Theory Techniques |
Early Access |
2019.11 |
SCI |
IC lab, MMIC, AAD, MCS |
